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        Adeneo launches bevy of Windows CE 6.0 R3 BSPs

        Jonathan Angel | Date: Oct 2, 2009 | Comments: 1


        Adeneo has announced Windows CE 6.0 R3 BSPs (board support packages) for a bevy of processors and platform architectures. Supporting CPUs from Atmel, Freescale, Intel, NXP, STMicroelectronics, and Texas Instruments (TI), the BSPs support Microsoft's newly embedded Silverlight technology, the company says.

        Windows Embedded CE 6.0 R3 was launched at last month's Embedded Systems Conference (ESC) in Boston, where it was described as "the next generation platform of the componentized, real-time Windows Embedded CE operating system."

        The first significant upgrade to Windows CE since the release of Windows Embedded CE 6.0 R2 in November 2007, the revised operating system continues to run on x86, ARM, MIPS, and Hitachi SuperH processors. A key addition is an "out-of-browser, native code implementation" of Microsoft's Silverlight technology, allowing developers to "dramatically improve user interface capabilities," according to the company.

        Other added features in Windows Embedded CE 6.0 R3 include the following, according to Microsoft:

        • New touch and gesture capabilities, including flicking and scrolling
        • A revised version of Internet Explorer (IE) that allows zooming and panning around web pages
        • PDF viewing capabilities, supplementing the existing viewers for Microsoft Office documents
        • Easier connection to Windows 7 desktops via Windows 7 Device Stage
        • An enhanced Connection Manager

        Windows CE 6.0 R3 has already attracted BSPs from Bsquare (for TI's OMAP35x EVM) and MPC Data (for TI's DM355). Now, more than a dozen R3 BSPs have been announced by Adeneo, already well-known for its previous work with Windows CE.

        According to Adeneo, the newly available R3 BSPs are for the following architectures (links provided lead to our coverage of previous BSPs for each CPU, whenever possible):

        Yannick Chamming's, CEO of Adeneo Embedded, stated, "The successful migration of all our BSPs to Windows Embedded CE 6.0 R3 confirms Adeneo Embedded's positioning ... including not only the low level BSP and driver system integration, but also the development of revolutionary user interfaces using Silverlight technologies and Microsoft Expression Blend. For many months, our engineering team collaborated closely with Microsoft in the development of complete solutions using Silverlight for Windows Embedded as well as Windows Embedded CE 6.0 R3, and provides a unique expertise in this new technology."

        In a previous interview with WindowsForDevices, Microsoft product manager David Wurster said the new Silverlight for Windows Embedded is implemented as C++ code rather than as a managed .NET backend, and will allow OEMs to create custom user interfaces within days. Silverlight will deliver "rich, immersive experiences" across every type of device, from digital picture frames for consumers to automation panels for industrial systems, he added.

        Availability

        Adneo suggested that its new Windows Embedded CE 6.0 R3 BSPs are available now, but did not provide pricing or other specifics.

        More information on the company's reference BSPs for silicon vendors may be found here, and information on ready-to-use BSPs for off-the-shelf boards may be found here.

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