The BCM2153 HSPA processor,
which began sampling in February, combines applications, multimedia, and 3G modem processing functions on a single chip. This high level of integration "enable[s] a powerful smart phone platform at feature phone prices," the company claims.
Typical BCM2153-based system design
(Click to enlarge)The mixed-signal BCM2153 is built on a 65 nanometer CMOS process and integrates a Category 8 HSDPA modem capable of 7.2 Mbps 3G data rates, according to Broadcom. Further details on the chip appear
in our earlier coverage. A block diagram of the chip's internal functions is available
here.
"As the 3G cellular market evolves towards higher speed connections such as high-speed packet access (HSPA), mobile operators and handset manufacturers are demanding advanced, open operating systems (such as Windows Mobile) and affordable hardware platforms to deliver high quality multimedia and other advanced features to consumers," the company stated.
In a statement, Jim Tran, Vice President and General Manager of Broadcom's Mobile Communications line of business, said: "We expect smart phones to capture increasing market share as optimized silicon solutions drive handset costs lower. By expanding our Windows Mobile engineering team with local Microsoft development expertise in Taiwan, we have created a true Microsoft-based design center of excellence that will help our customers bring to market innovative new smart phone products based on Windows Mobile."
The Broadcom Taiwan Design Center is located in the Xin-Yi district of Taipei City, according to the company. The center "employs a sizable team of software development engineers focused on smart phone software and the integration of Microsoft Windows Mobile applications with Broadcom cellular hardware and software platforms."
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