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        Cortex-A8 module gets 3G dev kit

        Jonathan Angel | Date: Oct 31, 2008 | Comments: 1



        Bsquare has announced a new 3G development kit designed to work with Windows CE and the Texas Instruments (TI) OMAP35x evaluation module (EVM). The "3G Wireless Dev Kit" lets OEMs incorporate 3G connectivity in TI OMAP35x processor-based designs "in up to 60 percent of the time typically required," says Bsquare.




        The 3G Wireless Dev Kit includes a Sierra Wireless MC5727 embedded radio module certified for EV-DO Revision A networks, plus pre-integrated Windows CE 6 radio interface layer (RIL) software, says Bsquare. Also included is an interface board that connects the embedded radio to the TI OMAP35x EVM, the company adds.

        The TI OMAP35x EVM, designed by Mistral Solutions and marketed by TI, supports the chipmaker's Cortex A8-based OMAP3530, a top model in the OMAP35x product line (below).


        TI's OMAP35x product line
        (Click to enlarge)

        The OMAP35x processors are based on a 600MHz Cortex-A8 core, with integrated peripherals, and target embedded applications and consumer electronics devices. For more information, see our earlier coverage, here.


        The OMAP35x EVM, produced for TI by Mistral
        (Click to enlarge)

        As for the OMAP35x EVM, pictured above, this includes not only an OMAP3530 processor module, but also a main board measuring 7 by 4.25 inches. The combination provides 128MB of RAM, 256MB of flash storage, and a 3.7-inch touchscreen display available in 640 x 480 or 320 x 240 resolutions, says Mistral.

        "Real world" interfaces include the following, according to the company:
        • USB 2.0
        • TV-out with both composite and S-Video
        • Audio line in and headset out
        • SD/SDIO slot
        • 10/100Mbps Ethernet
        • Keypad
        • I2C
        • 2 x UART ports
        • JTAG
        Meanwhile, the following additional interfaces are said to be available via the device's expansion connector:
        • Serial Peripheral Interface (SPI)
        • I2C (2)
        • UART (3)
        • MMC/SD (2)
        • 16-bit GPMC (general-purpose memory controller)
        • 12-bit digital video in for camera
        • 4-bit digital video out for display
        • GPIOs
        • Embedded trace macrocell interface
        Raj Khera, Bsquare's vice president of products, said "The 3G Dev Kit in combination with the powerful multimedia capabilities of TI's OMAP35x application processor enables OEMs to build compelling new devices which can easily send and receive rich multimedia content over cellular networks."

        Further information

        Bsquare's 3G Wireless Dev Kit was demonstrated with the Sierra Wireless MC5727 embedded radio module and the TI OMAP3 EVM in TI's booth at this week's Embedded Systems Conference (ESC) Boston. However, pricing and availability information was not announced.

        Meanwhile, the OMAP35x EVM is available now, priced at approximately $1,500. The required OMAP3530 processor module adds another $650, according to Mistral.

        For more information on the OMAP35x EVM, see the Mistral Solutions website, here.



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