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  • Home > News

        Driver doubles Windows CE WLAN throughput

        Jonathan Angel | Date: Oct 23, 2007 | Comments: 1



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        • Filed Under: News

        SyChip has announced a driver for Windows CE- and Mobile-based devices it says will more than double their wireless LAN performance. The company's "High-Speed WLAN SDIO Driver" (HS-SDIO) is said to provide data throughput of up to 16 Mbps.




        SDIO is the most popular interface in mobile WLAN-enabled devices today, the company claims. Therefore, the new driver "provides designers with a high performance wireless solution that can be quickly integrated into handheld devices," SyChip said in a statement.


        SyChip's HS-SDIO driver architecture

        SyChip says its HS-SDIO driver operates with the company's WLAN modules and will eventually support most popular application processor platforms in the mobile device market. The version to be released during the fourth quarter of 2007 supports the Marvell PXA27x and PXA3xx family of processors. Additionally, Samsung's 244x; TI's OMAP 2430, 850, 950; and Freescale's i.MX31 are "on the roadmap," according to the company.

        According to SyChip, the HS-SDIO driver works with Windows CE 5 and 6 in addition to Windows Mobile 5 and 6. A previous SDIO driver from the company was integrated into Microsoft's Windows CE 5.0 Platform Builder tool, suggesting that HS-SDIO will be similarly included in the future.

        In addition to WLAN-only modules, SyChip has produced combination modules such as the VWLAN7101, which offers both WLAN and VoIP. The company also recently announced the WiMAX95xx, which it says will be the first in a family of WiMAX modules.



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