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        COM Express module has soldered-on CPU and RAM

        Eric Brown | Date: Mar 9, 2010 | Comments: 1


        GE Intelligent Platforms announced a rugged COM Express module with an Intel Core 2 Duo CPU. The bCOM2-L1100 offers soldered processors and memory, shock and vibration protection, an extended temperature version, RAID support, and an optional carrier board, the company says.

        The bCOM2-L1100 is designed for use in harsh, space-constrained environments, such as mining, oil and gas, manufacturing, test/measurement, unmanned vehicles, exploration, transportation, and military/aerospace, says GE Intelligent Platforms. According to the GE-owned company, the board stands out from most rugged COM Express format modules in that it uses an Intel Core 2 Duo instead of an Intel Atom. In addition, says the company, the board uses soldered memory, as opposed to a SODIMM, making it easier to cool while providing better MTBF.


        bCOM2-L1100
        (Click to enlarge)

        The bCOM2-L1100 features an Intel Core 2 Duo processor operating at up to 2.26GHz, and includes up to 4GB of DDR3 SDRAM, says GE. Both the CPU and RAM are soldered to the module, along with other components. In addition, mechanical stand-offs are said to provide insulation from external forces, including shock and vibration. An extended temperature version withstands -40 to 185 deg. F (-40 to 85 C) temperatures, the company adds.

        The bCOM2-L1100 offers considerable connectivity, much of which is carried forward with real-world ports on an associated CCAR-L1000 carrier board (see farther below). Expansion is provided via PCI Express (configurable as one 4x lane or four 1x lanes), as well as an x16 PCI Express port for high-end graphics and video applications, says GE. For storage, the module supplies four RAID 0 and 1 configurable SATA ports and an IDE/PATA port, says the company.


        bCOM2-L1100 block diagram
        (Click to enlarge)

        Interfaces are provided for a gigabit Ethernet port, eight USB 2.0 ports, and eight GPIO ports (four in, four out). Audio/video interfaces, meanwhile, are said to include an LVDS port, two SDVO channels, VGA, and high-definition audio.

        Specifications listed for the bCOM2-L1100 include:

        • Processor -- Intel Core 2 Duo, up to 2.26GHz (soldered); 1066MHz FSB; 6MB L2; 25 W TDP
        • Memory -- Up to 4GB of DDR3 SDRAM (soldered, non-ECC)
        • Chipset -- Intel GS45/ICH9M SFF chipset (800/1067MHz FSB)
        • Display/graphics:
          • 1 x VGA
          • 2 x SDVO channels (shared with PEG)
          • 1 x LVDS interface (dual channel support)
        • Expansion:
          • 1 x PCI Express x16
          • 4 x PCI Express x1 or 1 x PCI Express x4
          • PCI (master), four devices
        • Storage:
          • 4 x SATA 1.0 interfaces
          • Supports SATA-II devices with speeds up to 3Gbps
          • Supports RAID 0 and RAID 1
          • 1 x IDE (PATA) interface
        • Networking -- 1x gigabit Ethernet port
        • Other I/O -- 8 x USB 2.0 interfaces; 8 x GPIO (4 in, 4 out) ports
        • Other features:
          • Supports high-def audio
          • States: S0, S1, S2, S3, S4, S5
          • ITPM (Intel Trusted Platform Management)
          • Alarm sensors for temperature and chipset
        • Operating temperature -- 32 to 140 deg. F ( 0 to 60 deg. C); ext. temp version -40 to 185 deg. F (-40 to 85 C)
        • Dimensions -- 3.74 x 4.90 inches (95 x 125mm); PICMG COM Express R1.0
        • Power -- 12V, 5 VSB
        • Operating system -- Windows XP, Windows Vista, Windows 7, Linux, VxWorks
        CCAR-L1000 carrier board

        A CCAR-L1000 carrier board for the bCOM2-L1000 is available for initial development and testing, says GE Intelligent Platforms. The CCAR-L1000 is said to be equipped with the bCOM2-L1000, processor, memory, and an ATX power supply. Expansion cards are available, and the board can be used to configure RAID 0 or 1 on SATA drives, says the company.



        CCAR-L1000 carrier board

        Specifications listed for the CCAR-L1000 carrier board include:
        • Expansion:
          • 1 x PCI Express x16 slot
          • 2 x PCI Express x1 slots
          • 4 x PCI 2.3 slots
          • 1 x CompactFlash socket
        • Rear-panel interfaces:
          • Mouse and keyboard
          • Serial
          • Ethernet
          • USB
          • VGA
          • Audio
        • On-board interfaces:
          • USB
          • Serial
          • Parallel
          • Graphics
          • LCD brightness
          • LVDS LCD Panel
          • LCD/inverter power
          • Audio
          • Front audio
          • CD-In
          • S/PDIF In/Out
          • IrDA
          • SATA
          • IDE (40 pin)
          • FDD
          • Digital I/O
          • Power
        Stated Juergen Eder, product manager at GE Intelligent Platforms, "Not only does the bCOM2-L1100 provide a solution for customers who need the kind of rugged reliability associated with VMEbus and PCI Express in the small form factor of COM Express, but it is also unique in the way it combines performance with rugged reliability. The bCOM2-L1100 delivers outstanding performance/watt from a small, lightweight platform and is ideal for deployment in the most demanding environments."

        Availability

        GE Intelligent Platforms did not offer pricing or availability on the bCOM2-L1100. More information on the board, which supports Windows XP, Windows Vista, and Windows 7, Linux, and VxWorks, may be foundhere.

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