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  • Home > News

        Key enhancements in Windows XPe SP2 FP 2007

        Doug | Date: Oct 3, 2006 | Comments: 1



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        • Filed Under: News

        This whitepaper, the first in a series leading up to the Nov. 1 official launch of Windows XP Embedded SP2 Feature Pack 2007, highlights some of the new release's major enhancements, principal of which was to pack more features into a smaller footprint.




        Lynda Allen, the paper's author and a member of the Windows XP Embedded Test team, explains that there were two major aspects to footprint reduction: re-factoring some larger, complex features into smaller, more granular components; and removing old, unnecessary dependencies. Refactoring involved extensive analysis of component features and dependencies and then breaking large components down into smaller ones with a higher degree of granularity.

        Allen then goes on to describe several other categories of enhancements in XPe SP2 FP 2007, including:
        • Configurable component settings
        • Macro components
        • Headless device support
        • Bug fixes and security fixes
        Read the complete paper here:

        Component Enhancements in Windows XP Embedded SP2 Feature Pack 2007




        Related stories:
        • Microsoft seeks Windows XPe CTP projects
        • Windows XPe upgrade includes command line app
        • Windows XPe FP 2007 CTP ready for action
        • Windows Embedded live chats coming this fall
        • "Feature Pack 2007" enhances Windows XPe
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