according to the company.

The Eclipse II family's thin, fine-pitch (0.5mm) BGA (ball grid array) package has 196 balls in an 8x8 mm footprint.

According to QuickLogic, tight component spacings along with the lack of active cooling mechanisms in handheld devices requires chips to support extended temperature ranges, particularly on the high side. Additionally, handheld devices are often used outdoors or left in vehicles and expected to be ready for operation regardless of ambient temperature. Accordingly, QuickLogic has qualified the 8x8 mm BGA package for use in the "industrial temperature range" of -40 to +100 degrees C.


Eclipse II block diagram
The Eclipse II's development board, the "Mobile Application Board" (MAB), is supported on Intel's PXA27x Development Platform, the "Mainstone" DVK. The MAB connects into the VLIO connector of the DVK, allowing designers to make system measurements and architecture tradeoffs including power consumption, performance, and cost, according to QuickLogic.

In addition to drivers for Windows CE, QuickLogic also supports the Eclipse II's IP blocks with Linux drivers.

Price and Availability

Eclipse II products in 8x8 mm packaging are immediately available. Pricing for the QL8150-6PUN196C is expected to be less than $5 in high volume quantities by the end of 2006, according to QuickLogic.

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