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        World's smallest COM?

        Eric Brown | Date: Jan 19, 2010 | Comments: 1



        Via Technologies announced a 2.36 x 2.36-inch computer-on-module (COM) based on its new Mobile-ITX form factor. The Via Epia-T700 is built around a 1GHz Via Eden ULV processor with 512MB soldered DDR2 memory, and supports the development of ultra-compact embedded devices in medical, military, and in-vehicle applications, says the company.


        The Via Epia-T700 is the first COM to support the Mobile-ITX format, which Via announced in early December. Touted as being the industry's smallest COM format, Mobile-ITX measures 2.36 x 2.36 inches (6cm x 6cm) and consumes from 12 Watts to below one Watt, says Via.


        Via Epia-T700

        (Click to enlarge)

        Mobile-ITX is the latest in a series of form factors created by Via,which have included 2001's Mini-ITX,2004's Nano-ITX,and 2007's Pico-ITX.Mobile-ITX continues Via's tradition of halving the surface areacompared to the previous format, but it differs from its predecessors inthat it is not a complete motherboard, with real-world connectors orpin headers. Instead, the COM relays all I/O signals and receives 5VDCpower through a pair of 120-pin connectors.

        Via's COM-oriented approach to Mobile-ITX is intended to offer easyintegration into to a custom designed carrier board. This places it incompetition with COM formats such as Qseven,which measures 4,900 square millimeters compared to Mobile-ITX's 3,900square millimeters. (Older and larger COM formats include PC/104,and COMExpress.)




        The flip-side of the Epia-T700, showing dual connectors
        (Click to enlarge)

        Combining a 1GHz Via Eden ULV CPU with Via's VX820 chipset, the Via Epia-T700 supplies 512MB of DDR2 on-board system memory, says Via. The VX820 chipset provides the Via Chrome9 DX9 integrated graphics core, and the Via Chromotion video engine, which is said to offer hardware acceleration of MPEG-2, MPEG-4, WMV9, and VC1video formats. The chipset also offers Via Vinyl HD audio technology, which supports up to eight channels of HD audio, along with a separate Via VT1708B audio chip.



        Epia-T700 detail

        (Click to enlarge)

        The Via Epia-T700 is equipped with a multi-configuration transmitter, enabling connections to TTL LCD panels and CRT monitors. Meanwhile, carrier board configurations can integrate the DVP interface to include LVDS and DVI support, says Via.

        The COM connects to carrier boards via the Mobile-ITX format's dual connectors. Located on the underside of the module, the 120-pin connectors are said to withstand vibrations of up to 5Gs, making the COM suitable for in-vehicle and industrial machining applications, says the company.



        Epia-T700 block diagram

        (Click to enlarge)

        Integrated data bus technologies on the Epia-T700 are said to include PCI Express and Ultra DMA, supporting a single-channel IDE hard drive. The COM also supports five USB 2.0 ports, as well as a wide variety of I/O including SMBus, LPC, VCP, GPIO, and dual SDIO connections. A reference carrier board (pictured below) also appears to be available, although the company did not offer more details. 



        Via's reference carrier board with piggybacking Epia-T700

        (Click to enlarge)

        Features and specifications listed by Via for its Epia T-700 module include:

        • Processor -- Via C7-M ULV clocked at 1.6GHz, in 6 x 6mm mobileBGA package
        • Chipset --- VX820 northbridge/southbridge, with 400MHz frontside bus, in 21 x 21mm package
        • Memory -- 512MB of DDR2 RAM
        • Expansion:
          • PCI Express 1.0a support, offering 1 x1 lane port
          • 2 x SDIO host controller
        • Graphics:
          • VIA Chrome9 HC3 integrated graphics processor with 2D/3D video controllers
          • VGA display interface, supporting resolutions up to 1920 x 1440 pixels
          • 18-bit TTL interface for LCD panels
        • Other I/O:
          • 1 x IDE
          • 1 x SMBus
          • 1 x LPC
          • 5 x USB 2.0
          • 1 x audio
          • 4 x GPIO
          • Video capture port
        • Power -- Supports single 5VDC power input
        • Dimensions -- 2.36 x 2.36 inches (60 x 60mm)
        • Weight -- 0.65g (18.6g)

        Stated Daniel Wu, VP, Via Embedded Platform Division, Via Technologies, "The Via Epia-T700 takes advantage of the modular design principles inherent in our Mobile-ITX form factor specification, making it easier than ever before to create astonishingly compact x86 devices that don't compromise on features."
         


        Epia-T700 on YouTube

        (Click to play)

        Availability

        Via did not provide pricing or availability information on the Epia-T700, but says it supports Linux, Windows XP, Win CE, and XPe. More information may be found here. A Via white paper on Mobile-ITX may be found here.


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