NXP says the BGM220 builds on its predecessor, the
BGW211, but offers a "significantly smaller form factor and highly optimized dynamic power management." The device is packaged in an 81-pin TFBGA measuring 5 x 5 mm, versus the BGW211's dimensions of 10 x 15 mm. The BGM220 facilitates the deployment of a complete, semi-discrete WLAN system implementation within 100 square millimeters of board space, according to the company.
BGW211 block diagram
(Click image for larger view)The BGM220 includes both the RF and Baseband/MAC functions with an SDIO/SPI host interface. A built-in ARM7 processor offloads WLAN-related tasks from the host processor. Earlier this year, Bsquare released an
Windows Mobile SDIO driver for the BGW211 that presumably will work on the BGM220 with little or no modification.
NXP says the BGM220 meets key WFA (
Wi-Fi Alliance) interoperability requirements including WPA2 and WMM, and supports all relevant enterprise security requirements with CCX extensions. Additionally, the SoC supports simultaneous Bluetooth and WLAN connectivity through a single antenna.
According to NXP's VP of Business Line Connectivity, Paul Marino, "The proliferation of wireless networks is enabling manufacturers to develop new and engaging multimedia devices for a range of different end users. As such, a greater range of non-traditional handheld devices, including personal media players and handheld game consoles, are being enabled with WLAN capabilities."
AvailabilitySample quantities of the BGM220 are expected to be available in Q2 of 2007, with production quantities coming in Q4. Pricing was not disclosed.
In addition to supporting the SoC on Windows CE and Windows Mobile, NXP says it also provides drivers for Linux and Symbian.
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