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Intel's dual-core mobile-x86 goes embedded
Feb. 14, 2006

Intel is guaranteeing extended lifecycle availability of its dual-core mobile x86 processors, in hopes of winning embedded and communications customers. Core Duo processors are now available through the Intel Embedded Architecture (IEA) support program, and are already being used in embedded applications, the company says.

All x86 processors vendors, including Intel, AMD, and Via, typically release their mobile processor designs to the embedded market shortly after shipping them to laptop and notebook customers. Intel already has embedded customers for its Core Duo products, it says, including SBC (single-board computer) vendors and TEMs (telecommunications equipment manufacturers).


Intel Core Duo architecture

The Core Duo chips are built on 65-nanometer process technology, enabling two x86 processor cores to share die space with 2MB of shared cache, with a similar die footprint to older, single-core mobile x86 chips. The chips also feature a 667MHz front-side bus connecting them to compatible northbridge chips, such as that included in Intel's 945GM Express chipset.

SBC vendor Kontron's VP of marketing, Norbert Hauser, stated, "We currently have four designs using the Intel Core Duo processor. [The chip] allows us to deliver more features in the same footprint as a single core processor."

RadiSys VP Wade Clowes stated, "We are using the latest power efficient Intel dual-core processor to develop a high performance, state-of-the art embedded module that will be used for compute-intensive applications."

Last week, TenAsys announced that its INtime real-time extension to Windows XP and XP Embedded now supports the Core Duo processor. With one core dedicated to the INtime RTOS and the other to Windows, worst-case jitter is reduced to as little as 1-3 microseconds -- a 10-fold decrease compared to an equivalent speed single-core processor, according to the company.

Availability

Intel Core Duo processors are available to embedded systems designers now. An L2400 part features dual 1.66GHz cores, a TDP (thermal design power) of 15 Watts, and pricing of $316 in 1K quantities, in a 479-pin uFC-BGA package. An T2500 part features dual 2.0GHz cores, a TDP of 25 Watts, and pricing of $423 in 1K quantities. It is available in 478- or 479-pin uFC-BGA packaging.

Additionally, Intel plans to offer a $1,500 embedded development kit within 30 days for its Core Duo and Mobile Intel 945GM chipset, it says.

Intel did not specify the length of the extended lifecycle term.



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