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New chip to reduce smartphones to feature-phone costs
Feb. 13, 2006

Amoi Electronics, HTC, and Sagem Communication are developing Windows Mobile smartphones based on a cost-reduced, highly-integrated mobile phone chip from Texas Instruments (TI), Microsoft and TI announced Monday. Handsets, based on TI's OMAPV1030 GSM/GPRS/EDGE chip are expected to begin shipping within 12 months.

TI claims that the single-chip, dual-core (RISC/DSP) OMAPV1030 offers smartphone capabilities "at feature phone costs," as a result of higher levels of integration, more aggressive process technology, and better system partitioning.


OMAPV1030 block diagram
(Click image for larger view)

The OMAPV1030 processor is based on the OMAP1710 architecture, and integrates an ARM926TEJ core with a TI DSP along with a wide range of connectivity options including support for GSM, GPRS, and EDGE communications. It is fabricated in TI's 90nm digital process technology. A companion analog chip provides fully integrated power management, audio codecs, and drivers, TI said.

TI lists the following key capabilities of the OMAPV1030:
  • Digital camera up to 2-megapixels
  • Video capture, playback, and streaming
    • QCIF format -- 30 frames per second
    • CIF format -- 15 frames per second
  • Digital audio in MP3 and other audio formats
  • Two color LCD screens up to QVGA resolution
  • 2D and 3D gaming
  • 64 polyphonic MIDI ringtones
  • Hardware-based security
"TI's integrated and optimized OMAPV1030 solution was designed to deliver enhanced features at a reduced cost," Edgar Auslander, general manager of worldwide strategy and corporate development for TI's wireless business unit, said in a statement. "Combined with Windows Mobile software from Microsoft, the OMAPV1030 will enable handset manufacturers like Amoi, HTC, and Sagem Communications to bring advanced multimedia and productivity features to mainstream mobile phones."



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